An empty data-hall floor. Rows of racks rise, amber copper links light inside each rack, teal optical fibres race across the rows to the spine switches, and the camera lifts to a top view of the hall.

Copper inside the rack.

Passive and active copper where the distance is short and the budget is power.

Optics across the hall.

Fibre from the row to the spine, where copper runs out of reach.

400G → 800G → 1.6T.

800G is mainstream for AI clusters today. 1.6T is ramping.

The layer every AI cluster runs on.

An AI cluster is only as fast as the links between its GPUs. We are India’s partner for the copper and optical interconnect that carries that traffic — supplying and designing it in today, and building the capability to manufacture it here.

Copper is cheaper. Optics goes further.

Typical maximum reach by media type. Indicative figures — actual reach depends on speed, cable construction and the link budget you design to.

  • DACPassive copper0 m
  • ACCLinear redriver0 m
  • AECRetimer / DSP0 m
  • AOCActive optical0 m
  • Single-modeAcross the hall0 m

Log scale · copper fades at its reach · optics keeps going

What is actually in there.

  • HousingThe metal shell. Grounds the module and holds everything in line.
  • Heat sinkPulls heat out. At 800G a module runs hot enough that this sets the limit.
  • PCBCarries the high-speed lanes from the electrical edge to the optics.
  • DSP / retimerCleans up the signal and re-times it, which is what buys the extra reach.
  • Optical engineLasers and detectors. Turns electrical lanes into light and back.
  • FibreCarries the light out of the module and across the hall.

Illustrative. Not a specific vendor’s product.

Copper where it wins. Optics where it counts.

Scale-up inside the rack, scale-out between racks, scale-across the fabric. Every link gets the medium its distance and power budget call for — and nothing it does not.

< 5 W

800G multimode LPO, per end

Linear pluggable optics, no DSP. In mass production.

9 m

800G on copper

Retimed AEC. Up to 4 m at 1.6T.

1.6T

2×DR4 / DR8 LPO

Silicon photonics, 500 m single-mode.

1M+

Units shipped in 2024

Automated lines, 150 units an hour at over 98% yield.

Maximum reach by medium — partner specification
Built on800G1.6TWhere it goes
DACPassive copper4 m1 mIn-rack, GPU to switch. Lowest power and cost per link, no added latency.
ACCLinear redriver5 m3 mAdjacent racks and xPU-to-xPU, keeping copper's cost and power.
AECRetimer / DSP9 m4 mRow-level copper. The reach that keeps a rebuild out of the plan.
AOCVCSEL optics, LPO or retimedSR 100 m—Rack-to-rack and across the row, where copper should stop.
Pluggable opticsMultimode and single-modeSR 100 m · DR 500 m · FR 2 kmDR8 500 m · FR8 2 kmLeaf to spine and across the hall. Reconfigurable.
CoherentCoherent opticsComingComingLongest reach, between halls and buildings.

How far, how fast? Find your starting point.

Speed
Optimise for

Start from

ACC Active copper cable

A linear redriver extends copper past DAC reach while keeping copper's cost and power.

Also reaches 5 m: AEC · AOC (LPO) · SR8 LPO optics

Get a written link plan

Indicative, from published maximum reach. Your link budget, cable build and thermals decide the final answer.

Six families, one supply chain.

Supplied through our USA technology partner.

Direct attach copper

DAC

Passive, in-rack. No added latency.

800G to 4 m · 1.6T to 1 m

Active copper cable

ACC

Linear redriver, for xPU-to-xPU links.

800G to 5 m · 1.6T to 3 m

Active electrical cable

AEC

Retimer / DSP. Copper at row reach.

AEC: up to 9 m at 800G (partner specification)

Active optical cable

AOC

Optical reach inside the hall, LPO or retimed.

200G – 800G · to 100 m

Multi-mode and single-mode

Optical transceivers

LPO and full-retimed, SR to FR — 67 models.

400G · 800G · 1.6T

Structured fibre

Fibre cable assemblies

Trunks, breakouts, shuffle boxes and fibre array units.

Rolling out

Form factors

  • SFP56
  • QSFP56
  • QSFP112
  • QSFP-DD
  • OSFP
  • OSFP-RHS
  • OSFP-XD

Ethernet and InfiniBand.

Speeds

  • 400GInstalled base
  • 800GMainstream for AI clusters
  • 1.6TRamping
  • 3.2TNext

Indicative direction, not dated commitments.

Take the DSP out, and the watts go with it.

Why linear optics

An LPO module drives the laser straight from the switch SerDes, with no DSP or CDR in the module. That takes out the part that burns the most power and adds the most latency, and lowers the cost per port.

What it draws

Under 5 W per end at 800G multimode and about 3 W at 400G. Across a few thousand ports, the watts a DSP would have burned go back to the GPUs.

When to use retimed instead

Full-retimed (DSP) optics stay the safer choice where the host SerDes is marginal or the link budget is tight. The catalogue carries both, so the choice is made per link rather than per vendor.

The optical catalogue
Models67 pluggable transceivers · 16 AOCs · 27 each of DAC, ACC, AEC
Data rates400G · 800G · 2×400G · 1.6T
Lane rates50G, 100G and 200G per lane (PAM4)
ArchitecturesFull-retimed (DSP) and linear pluggable (LPO)
Reach classesSR4 / SR8 to 100 m · DR4 / DR8 to 500 m · FR4 / FR8 to 2 km
Form factorsOSFP (flat-top, RHS, closed-top) · QSFP-DD · QSFP112 · QSFP56 · breakouts
CoolingAir, liquid and immersion, single- and two-phase coolant
ManagementCMIS 4.0 and 5.x · Class 1 laser

Proven on the platforms your fabric runs on.

The best specification does not matter if the ecosystem cannot keep up. Every design is qualified on current test systems and for interoperability on production switches, by third parties as well as in the lab.

  • Switches

    Broadcom Tomahawk 6 platforms, NVIDIA Spectrum Ethernet and Quantum InfiniBand switches.

  • NICs and DPUs

    NVIDIA ConnectX-8 800G SuperNIC, ConnectX-9 and BlueField-4, in Ethernet and InfiniBand.

  • Multi-vendor plugfests

    Passed CMIS 5.3 compliance and interop at the 43rd InfiniBand and RoCE Plugfest (IBTA / UNH-IOL), at 800G and 1.6T.

  • Test equipment

    Links proven on Keysight and VIAVI test systems — 800G copper at 9 m holding pre-FEC BER better than 1E-8.

Standards

  • IEEE 802.3dj
  • IEEE 802.3ck
  • IEEE 802.3cd
  • OSFP MSA
  • QSFP-DD MSA
  • CMIS 5.x
  • InfiniBand NDR · HDR · XDR
  • Ethernet 400G / 800G
  • OCP
  • RoHS · REACH

Loopback testers

31 loopback modules from 25G to 1.6T, SFP56 through OSFP-XD — passive at 0 W, or active up to 60 W to load a port thermally the way a real module does. The fastest way to qualify a switch before the optics arrive.

Proven designs, made to work in your environment, at scale.

Design is part of the work, but it is not the point. The point is everything that turns a design into a qualified product running in your cluster — and the capacity to deliver it in volume.

  1. 01

    Choose

    Start from a proven design on leading silicon, matched to the reach, power and timeline of your cluster — not a catalogue to sort through.

  2. 02

    Guarantee

    The design is stood behind. When a build genuinely needs something custom, the engineers design and qualify it.

  3. 03

    Prove

    Make it work in your environment before deployment: signal integrity, link margin, thermals and interop, on your switches.

  4. 04

    Scale

    Once qualified, it is manufactured in volume — from ten units to the millions — on your timeline.

Automated

AI-driven production and test lines. 150 units an hour at over 98% yield on the copper lines.

Elastic

From ten units to the millions the largest deployments need, with capacity stood up in weeks rather than quarters.

Geodiverse

Production replicated across North America and Asia, so no single region is the one your supply depends on — and country-of-origin requirements can be met without re-engineering.

Engineering behind the link

  • Signal integrity
  • Power integrity
  • Thermal integrity
  • Optical design
  • Optoelectronics packaging
  • High-speed twinax
  • Advanced firmware
  • Testing at 800G · 1.6T · 3.2T

The capacity is being built now.

  • 0.3752020actual
  • 1.52025actual
  • 42030Savills
  • 4.52030Colliers
  • 122030Wood Mackenzie

Gigawatts of installed capacity

MeitY (2020 and 2025 actuals, Mar 2026); Savills India (Jul 2025); Colliers (May 2025); Wood Mackenzie via IANS (Jul 2026). Forecasts differ widely — treat 2030 as a range.

  • Mumbai790 MWteam
  • Chennai305 MWteam
  • Bengaluru182 MWteam
  • Hyderabad152 MW
  • Delhi NCR76 MWteam
  • VadodaraPraverse HQ

Operational capacity. Source: MeitY reply in Lok Sabha (Mar 2026). Schematic layout — positions are indicative, not a survey map.

Interconnect is a local business: someone has to be on site when a cluster is qualified, and on the phone in the same time zone when it is not. Four of those five markets are cities where we have team members.

Building India’s AI interconnect capability — in three phases.

Our USA technology partner builds the interconnect. Praverse does the Indian architecture, design-in, integration, qualification and support, for sovereign AI data centres.

Each phase is unlocked by customer demand, so capacity arrives when India’s AI build-out needs it — not before.

Our team works from the cities that hold most of India’s data-centre capacity, close to where deployments happen. Vadodara to Mumbai is about 400 km.

  • Data stays under Indian law

    Built around the DPDP Act 2023.

  • Resilient domestic supply

    Design-in and qualification happen in India.

  • Engineers and support in India

    On the same clock as you.

Where this goes.

  1. PHASE 1 · NOW

    Supply and design-in

    Interconnect supplied with our US technology partner, with India-side programming, testing, labelling and qualification, and support on local time.

  2. PHASE 2 · NEXT

    Semi-finished assembly in India

    Assembly of semi-finished interconnect in India, close to the clusters being built.

  3. PHASE 3 · PLANNED

    Indian manufacturing

    An Indian manufacturing facility for copper interconnect first, then optical, as volumes justify it.

Phases 2 and 3 are plans, not facilities. We will not show you a factory we do not have, and we will not quote a location, a capacity or a date until one is signed.

Designing a cluster?

Send us the topology and the distances. You get a written plan within two business days.